Journal of The Surface Finishing Society of Japan
Online ISSN : 1884-3409
Print ISSN : 0915-1869
ISSN-L : 0915-1869
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Novel Copper Wiring Fabrication Technology Using Silver as a Plating Seed
Norimasa FUKAZAWA, Rei TAMURA, Wataru FUJIKAWA
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Keywords: Silver-Seed Plating Technology, Smooth and Flat Wiring Surface, High-Speed Signal Transmission, Low-Loss Transmission Line, High Insulation Reliability
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2024 Volume 75 Issue 11 Pages 500-506

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Journal of the Metal Finishing Society of Japan

Genba Panfuretto

Jitsumu Hyomen Gijutsu

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