無電解めっき法を用いたFe基板へのSn高含有（＞ 30 at.%）Ni-Sn薄膜の作製（3） ～クラックおよびピンホール防止のための浴中の添加剤の検討～

岩本 享之; 水品 愛都; 刈谷 志穂; 河合 陽賢; 福西 美香; 松本 太

doi:10.4139/sfj.75.530

Tecnological Reports

Electroless Deposition of Ni-Sn Layers Having High Sn Content（＞ 30 at.%）on Fe Substrates（3）

～ Examination of bath additives to prevent the formation of cracks and pinholes on the Ni-Sn layers～

Takayuki IWAMOTO, Manato MIZUSHINA, Shiho KARIYA, Akimasa KAWAI, Mika FUKUNISHI, Futoshi MATSUMOTO

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Keywords: Electroless Deposition, Ni-Sn, Additives, Crack, Hole Formation, Thiourea, Hydroquinone

JOURNAL FREE ACCESS

2024 Volume 75 Issue 11 Pages 530-537

DOI https://member-cnki-net-s-1416.res.gxlib.org.cn:443/rwt/1416/https/MSYXTLUQPJUB/10.4139/sfj.75.530

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Abstract

This study investigated plating bath additive effects on the improvement of electroless Ni-Sn plating film resistance against aqueous sodium hypochlorite solutions. Surfaces of conventional electroless Ni-Sn coatings show numerous cracks and pinholes. Through these gaps, a sodium hypochlorite aqueous solution can corrode the substrate, thereby decreasing the chemical resistance of the plated coating. A plating solution bath to which a combination of thiourea and hydroquinone had been added reduced the internal stress of the plating film, suppressed the rate of crack formation on the film surface, and reduced pinhole formation. Findings also revealed that the resultant film had higher resistance than conventional Ni-Sn films.

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