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Volume 75, Issue 4
Displaying 1-6 of 6 articles from this issue
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Special Feature / Dispersion and Aggregation Control by Surface Control
Reviews
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Motoyoshi KOBAYASHI, Takuya SUGIMOTO, Shunsuke SATO, Ryouichi ISHIBASH ...2024 Volume 75 Issue 4 Pages 150-158
Published: April 01, 2024
Released on J-STAGE: October 01, 2024
DOIhttps://member-cnki-net-s-1416.res.gxlib.org.cn:443/rwt/1416/https/MSYXTLUQPJUB/10.4139/sfj.75.150JOURNAL FREE ACCESSDownload PDF (4044K)
Reviews
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－Use of DLS, ELS and Streaming Potential Method－Yuki NAKANO2024 Volume 75 Issue 4 Pages 159-165
Published: April 01, 2024
Released on J-STAGE: October 01, 2024
DOIhttps://member-cnki-net-s-1416.res.gxlib.org.cn:443/rwt/1416/https/MSYXTLUQPJUB/10.4139/sfj.75.159JOURNAL FREE ACCESSDownload PDF (2999K) -
Yuji NAKANISHI2024 Volume 75 Issue 4 Pages 166-171
Published: April 01, 2024
Released on J-STAGE: October 01, 2024
DOIhttps://member-cnki-net-s-1416.res.gxlib.org.cn:443/rwt/1416/https/MSYXTLUQPJUB/10.4139/sfj.75.166JOURNAL FREE ACCESSDownload PDF (1192K) -
Naoyuki ISHIDA2024 Volume 75 Issue 4 Pages 172-177
Published: April 01, 2024
Released on J-STAGE: October 01, 2024
DOIhttps://member-cnki-net-s-1416.res.gxlib.org.cn:443/rwt/1416/https/MSYXTLUQPJUB/10.4139/sfj.75.172JOURNAL FREE ACCESSDownload PDF (1735K) -
Fumihiko TAKAOKA, Kiyohiko KATO2024 Volume 75 Issue 4 Pages 178-184
Published: April 01, 2024
Released on J-STAGE: October 01, 2024
DOIhttps://member-cnki-net-s-1416.res.gxlib.org.cn:443/rwt/1416/https/MSYXTLUQPJUB/10.4139/sfj.75.178JOURNAL FREE ACCESSDownload PDF (4175K)
Letters
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Katsuhiko TASHIRO, Takeshi OTSUKA, Yuhei NAKAJIMA, Masahide SHIMA, Hid ...2024 Volume 75 Issue 4 Pages 185-187
Published: April 01, 2024
Released on J-STAGE: April 03, 2024
DOIhttps://member-cnki-net-s-1416.res.gxlib.org.cn:443/rwt/1416/https/MSYXTLUQPJUB/10.4139/sfj.75.185JOURNAL FREE ACCESSNodules during electroless NiP deposition were observed from the initial stage when using palladium catalyst method, but not when using iron strip contact method. When applying either method, the nodules ceased as the deposition thickness increased. Findings indicate that the influence of pretreating the copper substrate was much greater than the influence of sulfur additives in the plating bath.
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